PLUGGING PASTE .

ELPEPCB - PCB materials and lacquers; conformal coatings; encapsulants; bicomponent resins 'casting compounds', for electronics.

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Bubble-free HDI/SBU technology insulation layers. Screen, stencil and vacuum application. Low coefficient of thermal expansion, no cracking or delamination of the applied metallisation. UL Approved UL File No. E80315.