HIGH RELIABILITY LEAD FREE SOLDER PASTE SB6NX58.

KOKI - Leaded and lead-free solder pastes. SAC305, Low Ag, SnPb; type 3,4,5; high wettability, 'low voids', 'anti-pilow'. Welding wires

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SABI alloy (Sn/3.5Ag/0.5Bi/6.0In 0.8Cu+X)
High joint reliability in OSP and ENIG finishes
Shear resistant, less cracking
High temperature resistance even after 5000 thermal cycles, with substrates of different thermal expansion coefficients
Minimises deformation due to overheating ensuring extreme thermal shock durability.
Melting point 202-204 ºC
Applicable in air remelting with good wettability.
Halogen Free
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