HEAT AIR REPAIR STATION R6200.

Independent control of the 3 heaters, hot air up/down + IR booster on bottom preheating

Prism for component alignment between ball-pads.

Temperature accuracy ± 3 ºC. Precision thermocouple K for automatic adjustment of PID parameters. Mounting accuracy ± 0.01 mm.

Easy to program. Instantaneous curve analysis function and temperature analysis on BGA.

PCB size Max: 410 × 370 mm. Min. 65 × 65 mm. BGA Max: 80 × 80 mm. Min. 2 × 2 mm

The 'show' system can display 7 temperature curves and the data of millions of groups for different components can be stored.

Fits all types of BGA nozzles, with 360° component rotation, easy to install and replace. With optional side inspection camera